MediaTek Unveils Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones
Dimensity 700 caters to growing consumer demand for 5G devices MediaTek today unveiled its new Dimensity 700 5G smartphone chipset, a 7nm SoC designed to bring advanced 5G capabilities and experiences to the mass market. The addition of the Dimensity 700 to MediaTek’s Dimensity family of 5G chips gives device makers a full suite of options for 5G smartphone models – from flagship and premium to mid-range and mass market devices – making 5G more accessible for consumers everywhere. “With our expanded Dimensity portfolio we’re bringing the latest 5G capabilities to every smartphone tier so more people can enjoy 5G experiences,” said Dr. JC Hsu, Corporate VP and GM of MediaTek’s Wireless Communications Business Unit. “The Dimensity 700 has an impressive mix of 5G connectivity features, advanced camera capabilities like night shot enhancements and multiple voice assistant support, all in a super power-efficient design. The Dimensity 700 packs advanced connectivity features including 5G
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